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UL 796-2016 pdf free download

UL 796-2016 pdf free download.Printed-Wiring Boards.
16.1,2 The conductor pattern of Figure 10.1 is to be included on both of the sides of a sample, and the unpierced areas are to be positioned directly opposite each other,
Exception.’ If a ground plane (an external conductor layer used as a common reference point for circuit returns or heat sinking) is used by a fabricator, and the required maximum diameter unpierced circular conductor representing the ground plane area can not be accommodated in the conductor pattern of Figure 10.1, a separate sample with the maximum diameter unpierced circular conductor shall be provided, on both sides, positioned directly opposite each other. See Figure 10.3 for an example test pattern. The conductor should not extend to The edge of the sample.
16.1.3 A double-sided board is representative of an identical board with a representative conductor pattern on one side when the single-sided construction has the same base material, total thickness, line width, solder limits and other parameters. A single-sided board is not considered as representative of a double-sided board.
16.1.4 A double-sided board shall be provided with contact fingers and plated through-hole constructions if used in production.
16.1.5 A connection between sides shall be smooth, uniform, and tree from cracks, nodules. segments and insulating coatings or other noncoriductive material that reduces the conductivity between the conductor patterns. In the test sample, an unsoldered plated-through hole shall not have voids exceeding 10 percent of the plated wall area.
16.2 Metal-clad (MCILJCCIL) base material program
16.2.1 When a metal-clad base material has been previously investigated in accordance with Metal Clad Laminates. Section 17 of the Standard for Polymeric Materials — Industrial Laminates, Filament Wound Tubing. Vulcanized Fibre, and Materials Used in Printed Wiring Boards. UL 746E. with regard to 1) the bond strength between the base material and the cladding metal after thermal shock and thermal conditioning and 2) the flammability classification of the base material (after etching off the cladding metal and after thermal shock), Bond Strength, Delamination and Blistering, and Flammability testing for the printed-wiring board manufacturer is not required to add alternate metal-clad base materials when the metal-clad base material meets the following requirements for single- or double-sided, single-layer printed-wiring boards:
a) The printed-wiring-board fabricator shall have been previously investigated for a printed- wiring board construction using a generically similar metal-clad base material — same UL/ANSI type — or a composite metal-clad base material with external surfaces of the same ULIANSI type, with the fabricator’s own process and parameters, including minimum laminate thickness, maximum solder limits, maximum operating temperature (MOT), minimum and maximum conductor cladding thickness, minimum midboard conductor, minimum edge conductor, maximum area diameter, and flammability classification.UL 796-2016 pdf free download.

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